Cooling electronic devices installed in a subsurface environment

ABSTRACT

An system and method for cooling of electronic equipment, for example a computer system, in a subsurface environment including a containment vessel in at least partial contact with subsurface liquid or solid material. The containment vessel may be disposed in a variety of subsurface environments, including boreholes, man-made excavations, subterranean caves, as well as ponds, lakes, reservoirs, oceans, or other bodies of water. The containment vessel may be installed with a subsurface configuration allowing for human access for maintenance and modification. Cooling is achieved by one or more fluids circulating inside and/or outside the containment vessel, with a variety of configurations of electronic devices disposed within the containment vessel. The circulating fluid(s) may be cooled in place by thermal conduction or by active transfer of the fluid(s) out of the containment vessel to an external heat exchange mechanism, then back into the containment vessel.

RELATED APPLICATION

This application is a continuation-in-part of U.S. patent applicationSer. No. 15/457,025, filed on Mar. 13, 2017 and entitled “COOLINGELECTRONIC DEVICES INSTALLED IN A SUBSURFACE ENVIRONMENT”, now issued asU.S. Pat. No. 10,240,845, issued on Mar. 26, 2019, which is acontinuation-in-part of U.S. patent application Ser. No. 14/378,261,filed on Aug. 12, 2014 and entitled “COOLING ELECTRONIC DEVICESINSTALLED IN A SUBSURFACE ENVIRONMENT”, now issued as U.S. Pat. No.9,593,876, issued on Mar. 14, 2017, which claims the priority of U.S.Provisional 61/698,365, filed on Sep. 7, 2012 and entitled “GEOTHERMALLYCOOLED COMPUTER HARDWARE SYSTEM DESIGNED FOR SUBSURFACE INSTALLATION”.

TECHNICAL FIELD

This disclosure relates to a system and method for cooling electronicdevices, including but not limited to computer systems, by installingthe electronic devices in subsurface environments such as boreholes,excavations, or bodies of water.

BACKGROUND

Large-scale data centers typically house hundreds or thousands ofcomputer systems in high-density configurations (side-by-side racks,with multiple computing nodes per rack) in an above-ground building.Some sources estimate that up to 50% of the electrical power consumptionfor data centers is dedicated to cooling the environment in which thecomputer systems operate.

The heat generated by the internal electronic components of computingdevices has long been a significant factor determining the overallsystem design of computer systems. The most common forms of heatdissipation in early personal computer designs were direct physicalcontact between the heat-generating integrated circuit chip and aheat-conducting mass such as aluminum, and non-turbulent airflow,typically generated by electrical fans, to circulate cool air through aspace interior to the computer system housing. In the early large-scalecomputing systems of the 1940s and 1950s, heat dissipation consistedprimarily of ventilation apertures in housings, followed by ambient-airfans and blowers which cooled by forced air convection.

Zelina, in U.S. Pat. No. 3,566,958 (1971), describes a means ofthermally coupling heat conductors to integrated circuit chips, thoughwithout addressing how to transport the heat contained in theheat-conducting material away from the space surrounding the electricaldevice. In U.S. Pat. No. 3,648,113 (1972) Rathjen describes a means ofstacking planar electronic devices, with spacing between the flatplanes, and cooling the entire assembly using fluid flow across the flatsurfaces; the cooling fluid exits the entire assembly, therebytransporting heat away from the heat-generating electronics. Austin, inU.S. Pat. No. 3,737,728 (1973) discloses a mounting structure forfragile heat-generating devices (e.g. devices used in computerapparatuses), as well as uniformity of heat conduction and good heatdissipation away from the core assembly area. These ideas are combinedin U.S. Pat. No. 3,865,183 (1975), in which Roush describes a morecomprehensive means of constructing a full computer assembly with goodheat dissipation characteristics of the individual circuit boards in themodule, with fluid flow for removal of heat energy from the assembly.

As semiconductor densities in computing devices continued to increase,progressively more heat was generated by the devices. Beginning in the1980s a series of advancements was made in the heat removal capabilitiesof computer systems, primarily through the use of liquids. Oktay, in1980 (U.S. Pat. No. 4,203,129) described the bonding of a heat sink tothe surface of a heat-generating electronic device, and immersing theother surfaces of the heat sink in a liquid, which circulates throughtunnels in the heat sink material. This innovation was followed byothers too numerous to mention by inventor and patent number, including:jacketing the CPU of a computer and placing liquid coolant directly incontact with the CPU jacket, with or without pumps for circulation ofthe liquid; increasingly complex valves and other electronicallycontrolled redundant cooling components for one or more CPUs or otherheat generating electronic components; various designs for the channelsand pipes carrying the liquid coolant; closed loop and open loop systemswith physical contact between loop housings and varying degrees of fluidexchange between them.

The cooling capacity of the earth's subsurface has long been recognizedas a potential energy-saving feature of systems that cool inhabitedenvironments. Because the subsurface maintains essentially a constanttemperature at a given depth and the rock and/or artesian mass andvolume of the subsurface are vast, heat can be exchanged with eitherwarmer surface fluid, thereby providing cooling, or cooler surfacefluid, thereby providing warming. Vignal and Chapuis, in U.S. Pat. No.3,965,694 (1976) describe a means of exchanging heat with the earth'ssubsurface via a U-shaped line or pipe buried in a deep hole bored inthe earth; their design is directed at systems for warming or coolingabove-ground air. Many devices since then have been disclosed thatimprove on various aspects of air-conditioning designs and provide formore efficient heat transfer between above-ground fluids and subsurfacerock or liquid.

The use of subsurface thermal capacity to control the operatingtemperature of electronic equipment was disclosed by Enlund in U.S. Pat.No. 6,397,933 (2002) for equipment installed in a station and by Kidwelland Fraim in U.S. Pat. No. 7,363,769 (2008) for the cooling ofelectronic equipment at the base of an electromagnetic signaltransmission/reception tower. The subject matter disclosed by Kidwelland Fraim describes a method and apparatus for using coaxial flow heatexchanging structures for regulating the temperature of heat-generatingelectronics installed in the base housing of an electromagnetic signaltransmission/reception tower. The heat transfer is effected using afluid flow loop from the surface to the underground environment and backto the surface. Chainer, in U.S. Pat. Application No. 2013/0081781describes a system for data center cooling wherein heat transfer fluidis removed from the indoor volume of the data center and cooled viaambient air and geothermal heat exchange processes.

Attlesey, et al. in U.S. Pat. No. 7,724,517 (2010) disclose a design ofa case for a liquid submersion cooled electronic device; the embodimentsdescribed therein include a liquid-tight case for enclosing electronicequipment, with at least a portion of one of the walls composed oftranslucent or transparent material for visibility into the interior ofthe case. In several subsequent patents, Attlesey describes cooling ofelectronic equipment by means of a dielectric liquid circulating in andthrough a fluid-tight container. Tufty et al. disclose a similarapproach in U.S. Pat. Application No. 2013/0081790 (April 2013).Campbell, et al. in U.S. Pat. No. 7,961,475 (June 2011) describe anapparatus and method for immersion cooling of one or more electronicsubsystems in which cooling fluid passes in and out of one or morecontainers docked within an electronics rack.

In conclusion, the heat generated by computer and other electronichardware results in significant cooling costs in environments, such asdata centers, where systems are deployed in high density configurations.

Unless specifically stated as such, the preceding is not admitted to beprior art and no statement appearing in this section should beinterpreted as a disclaimer of any features or improvements listed.

BRIEF DESCRIPTION OF THE INVENTION

At least one embodiment described herein provides a cooling mechanismfor electronic devices and systems of devices, including but not limitedto computer hardware systems, installed in a subsurface environment. Thedesign provides a significant improvement in long-term electronicequipment operating costs by eliminating the inefficiencies inherent inremoving heat from the human-inhabited environment of the facility inwhich the hardware is installed. The unique installation characteristicsof this invention are likely to lead to a lower average operatingtemperature of the hardware, which will translate into a longer averageoperational lifetime of the hardware. The design also results in a veryhigh security physical installation for electronic equipment systems.

In its most basic embodiment, the design comprises electronic devices,either as individual units or as a cluster of units, installed in acontainment vessel designed to conduct heat from the electronic devicesto a fluid within a containment vessel; cooling of the electronicdevices is accomplished by heat transfer from the electronic devices toa fluid within the containment vessel and finally heat transfer from thefluid to an external environment. The containment vessel existsprimarily or entirely in a subsurface environment and can have any size,shape, or orientation as dictated by the constraints of the particularinstallation requirements.

Electronic devices are installed in a containment vessel as individualunits or in a grouped as units in a high-density configuration. Multiplecontainment vessels may be installed together to form a group ofcontainment vessels that collectively house a large-scale installationof electronic devices. Designs are optimized for effective and efficientdirect transfer of thermal energy away from heat-generating electronicdevices enclosed in a containment vessel which is primarily or entirelyinstalled in a subsurface environment.

Heat generated by the electronic devices is transported away from theelectronic devices by either direct, indirect, or direct and indirectcontact with a cooling fluid that transports the captured heat to a)thermally conductive walls of a containment vessel and into theenvironment surrounding a containment vessel and/or b) an external heatexchanger assembly. Heat may be transferred from the fluid directly intothe subsurface environment via passive or forced circulation, or thefluid may be circulated out of a containment vessel, cooled in anexternal location, and then re-circulated back to a containment vesselat a lower temperature. A containment vessel may have entrances,optionally fluid-tight, for power, networking, control, monitoringsignals, and/or cooling fluid inlets and outlets.

Multiple configuration options are described for optimized installationof containment vessels into a variety of subsurface environments, suchas, but not limited to, a naturally occurring or man-made borehole,excavation, structure, well hole, or body of water (e.g. stock tank,reservoir, lake, pool, river, ocean, sea, stream, wetland, etc.). Theinstallation of a containment vessel can be in any orientation and canbe positioned at the surface or any distance below the surface, with orwithout direct contact to the above-surface environment. Electronicdevices are disposed within a containment vessel in a variety ofconfigurations that allow cooling fluid to flow over, around, through,and in the electronic devices to provide for heat transfer from theelectronic device to the cooling fluid. Electronics device units may bestacked or grouped together to form a single structural unit, or theymay be in close proximity as single units not in direct contact withother units.

These and other aspects of the disclosed subject matter, as well asadditional novel features, will be apparent from the descriptionprovided herein. The intent of this summary is not to be a comprehensivedescription of the claimed subject matter, but rather to provide a shortoverview of some of the subject matter's functionality. Other systems,methods, features and advantages here provided will become apparent toone with skill in the art upon examination of the following FIGS anddetailed description. It is intended that all such additional systems,methods, features and advantages that are included within thisdescription, be within the scope of the claims and any claims filedlater.

BRIEF DESCRIPTION OF FIGURES

The features characteristic of the invention are set forth in the claimsand any claims filed later. However, the invention itself and furtherobjectives and advantages thereof, will best be understood by referenceto the following detailed description when read in conjunction with theaccompanying drawings in which the left-most significant digit(s) in thereference numerals denote(s) the first figure in which the respectivereference numerals appear, wherein:

FIG. 1 shows a conceptual cross-section of a containment vessel withconvection cooling that encloses electronic devices with flow-overcooling which is designed for subsurface installation according to anembodiment of the disclosed subject matter.

FIG. 2 shows a conceptual cross-section of a containment vessel withconvection cooling that encloses electronic devices with cooling whichis designed for subsurface installation according to an embodiment ofthe disclosed subject matter.

FIG. 3 shows a conceptual cross-section of a containment vessel withexternal heat exchanger that encloses electronic devices with flow-overcooling which is designed for subsurface installation according to anembodiment of the disclosed subject matter.

FIG. 4 shows a conceptual cross-section of a containment vessel withexternal heat exchanger that encloses electronic devices with coolingwhich is designed for subsurface installation according to an embodimentof the disclosed subject matter.

FIG. 5 shows a conceptual cross-section of a containment vessel withexternal subsurface heat exchanger that encloses electronic devices withcooling which is designed for subsurface installation according to anembodiment of the disclosed subject matter.

FIG. 6 shows a conceptual cross-section of a containment vessel withexternal heat exchanger that encloses electronic devices with coolingwhich is designed for human-accessible subsurface installation accordingto an embodiment of the disclosed subject matter.

FIG. 7 shows a conceptual cross-section of an electronic device designedfor subsurface installation that comprises electronic components thatare cooled by external cooling fluid circulation according to anembodiment of the disclosed subject matter.

FIG. 8 shows a conceptual cross-section of an electronic device designedfor subsurface installation that comprises electronic components thatare cooled by interior channel and external cooling fluid circulationaccording to an embodiment of the disclosed subject matter.

FIG. 9 shows a conceptual cross-section of an electronic device designedfor subsurface installation that comprises electronic components thatare cooled by internal cooling fluid circulation according to anembodiment of the disclosed subject matter.

FIG. 10 shows a conceptual cross-section of an electronic devicedesigned for subsurface installation that comprises electroniccomponents that are cooled by interior channel and internal coolingfluid circulation according to an embodiment of the disclosed subjectmatter.

FIG. 11 shows an embodiment of indirect heat transfer using an internalheat exchanger.

DETAILED DESCRIPTION

Although described with reference to certain embodiments, those withskill in the art will recognize that the disclosed embodiments haverelevance to a wide variety of areas in addition to the specificexamples described below. Further, elements from one or more embodimentsmay be used in other embodiments and elements may be removed from anembodiment and remain within the scope of this disclosure.

All references, including publications, patent applications, andpatents, cited herein are hereby incorporated by reference to the sameextent as if each reference were individually and specifically indicatedto be incorporated by reference and were set forth in its entiretyherein; provided, however, to the extent there exists a conflict betweenthis disclosure and a document incorporated by reference, thisdisclosure shall control.

For the purposes of the present invention, the terms “electronicdevice”, “electronic devices”, “computer”, “computer systems”, “computerhardware systems”, “computer cluster”, “physical computer”, “computerserver”, and “server” are used interchangeably, and unless otherwisespecified comprise any number of electronic components or electroniccomponent assemblies.

For the purposes of the present invention, the term “fluid” is definedas a liquid, a gas, or a combination of liquid and gas.

For the purposes of the present invention, the terms “thermallyconductive fluid” and “cooling fluid” are used interchangeably and aredefined as a fluid capable of absorbing and rejecting heat.

For the purposes of the present invention, the term “adjacent” isdefined as adjoining, bordering, touching along an edge or a point, orhaving a common endpoint or border.

For the purposes of the present invention, the term “remote” is definedas not adjacent.

FIG. 1 shows a conceptual cross-section of a containment vessel withconvection cooling that encloses electronic devices with flow-overcooling which is designed for subsurface installation. The containmentvessel 100 encloses one or more electronic devices 116. The containmentvessel 100 is a sealed or unsealed structure which is near or anydistance below surface level 108. The containment vessel 100 isinstalled in either a removable or non-removable fashion in surroundingphysical materials 112 such as earth, water, or concrete. The sealedembodiment will have a sealing cap 104 which may be covered bysurrounding physical materials 112. The unsealed embodiment will havecontainment vessel walls 110 that extend to the surface of thesurrounding physical materials 112. A fluid-tight connector assembly 114extends through any sealing cap 104 to provide an entry port for power,control and electrical signal cabling 126 to and from a) one or moreelectronic devices 116, and b) any optional fluid circulators 132. Thecooling fluid 120 with surface level 122 partially or completely fillsthe interior volume of the containment vessel 100 and surrounds theelectronic devices 116. The cooling fluid 120 circulates within thecontainment vessel 100 in a manner as to effect the heat removal fromthe electronic devices 116. Fluid flow in and around the electronicdevices 116 may be accomplished by embodiments of electronic devices 116such as those described in FIGS. 7, 8, 9, and/or 10.

Heat from the warmer electronic devices 116 is transferred to thecooling fluid 120. The cooling fluid 120 convectively moves toward theupper region of the containment vessel 100 optionally assisted by one ormore fluid circulators 132. The cooling fluid 120 moves toward the wallsof the containment vessel 100 and flows along the walls of thecontainment vessel 100 toward the lower region of the containment vessel100. As the cooling fluid 120 moves along the walls of the containmentvessel 100, heat is transferred from the cooling fluid 120 to the wallsof the containment vessel 100 and into the surrounding physicalmaterials 112. The cooling fluid 120 flows to the lower region of thecontainment vessel 100 and then begins to move upward, flowing over theelectronic devices 116 to continue the heat removal cycle. The flow ofcooling fluid 120 over electronic devices 116 may be augmented by one ormore optional fluid circulators 132 which move the cooling fluid 120from the lower region of the containment vessel 100 to the upper regionof the containment vessel 100. An optional fluid control structure 136may be used to promote uniform fluid flow over electronic devices 116.Fluid control structures 134 may be located within the containmentvessel 100 in order assist in internal fluid circulation by providing aflow separation boundary between the cooler cooling fluid 120 whichmoves downward near the containment vessel 100 walls and the warmercooler fluid 120 which moves upward over the electronic devices 116.Multiple containment vessels 100 may be installed together to form agroup of containment vessels 100 that collectively house a large-scaleinstallation of electronic devices 116. The containment vessel 100 isoptionally comprised of thermally conductive materials.

FIG. 2 shows a conceptual cross-section of a containment vessel withconvection cooling that encloses electronic devices with cooling whichis designed for subsurface installation. The containment vessel 100encloses one or more electronic devices 116. The containment vessel 100is a sealed or unsealed structure which is near or any distance belowsurface level 108. The containment vessel 100 is installed in either aremovable or non-removable fashion in surrounding physical materials 112such as earth, water, or concrete. The sealed embodiment will have asealing cap 104 which may be covered by surrounding physical materials112. The unsealed embodiment will have containment vessel walls 110 thatextend to the surface of the surrounding physical materials 112. Afluid-tight connector assembly 114 extends through any sealing cap 104to provide an entry port for power, control and electrical signalcabling 126 to and from a) one or more electronic devices 116, and b)one or more fluid pumps 210. The cooling fluid 120 with surface level122 partially or completely fills the interior volume of the containmentvessel 100 and surrounds the electronic devices 116. The cooling fluid120 circulates within the containment vessel 100 in a manner as toeffect the heat removal from the electronic devices 116. Heat from thewarmer electronic devices 116 is transferred to the cooling fluid 120.The cooling fluid 120 flows in and around the electronic devices 116 ina manner that includes fluid flows described in embodiments ofelectronic devices 116 such as shown in FIGS. 7, 8, 9, and/or 10.

The cooling fluid 120 is circulated within the containment vessel 100 bymeans of one or more fluid pumps 210 that may be at any location and areshown as positioned in the lower region of the containment vessel 100. Afluid pump 210 has an inlet for cooling fluid 120, performs a pumpingaction on cooling fluid 120 and delivers the cooling fluid 120 to anoutlet that is attached to fluid distribution piping 220 which deliverscooling fluid 120 to each electronic device 116 as appropriate. Thepumping action of the fluid pump 210 moves cooling fluid 120 intoelectronic devices 116 and the fluid is discharged back into thecontainment vessel 100 through fluid exit ports 221. Fluid exit ports221 are shown as representative of ports that allow cooling fluid 120 tobe discharged from the interior of any electronic device 116. Eachelectronic device 116 may include any number of fluid exit ports 221that may be located at any appropriate location on electronic device116. The cooling fluid 120 moves both convectively and under pumpingaction toward the upper region of the containment vessel 100. The fluidpump 210 may be optionally configured to allow a portion of thecirculating cooling fluid 120 to bypass the fluid pump 210 inlet andflow upward in the containment vessel 100 over the electronic devices116 toward the upper region of the containment vessel 100 therebyeffecting additional heat transfer from the electronic devices 116. Anoptional fluid control structure 136 may be used to promote uniformfluid flow over electronic devices 116. Upon reaching the upper regionof the containment vessel 100, the cooling fluid 120 moves toward thewalls of the containment vessel 100 and flows along the walls of thecontainment vessel 100 toward the lower region of the containment vessel100. As the cooling fluid 120 moves along the walls of the containmentvessel 100, heat is transferred from the cooling fluid 120 to the wallsof the containment vessel 100 and into the surrounding physicalmaterials 112. The cooling fluid 120 flows to the lower region of thecontainment vessel 100 to continue the heat removal cycle. Fluid controlstructures 134 may be located within the containment vessel 100 in orderassist in internal fluid circulation by providing a flow separationboundary between the cooler cooling fluid 120 which moves downward nearthe containment vessel 100 walls and the warmer cooler fluid 120 whichmoves upward over the electronic devices 116. Multiple containmentvessels 100 may be installed together to form a group of containmentvessels 100 that collectively house a large-scale installation ofelectronic devices 116. The containment vessel 100 is optionallycomprised of thermally conductive materials.

FIG. 3 shows a conceptual cross-section of a containment vessel withexternal heat exchanger that encloses electronic devices with flow-overcooling which is designed for subsurface installation. The containmentvessel 100 encloses one or more electronic devices 116. The containmentvessel 100 is a sealed or unsealed structure which is near or anydistance below surface level 108. The containment vessel 100 isinstalled in either a removable or non-removable fashion in surroundingphysical materials 112 such as earth, water, or concrete. The sealedembodiment will have a sealing cap 104 which may be covered bysurrounding physical materials 112. The unsealed embodiment will havecontainment vessel walls 110 that extend to the surface of thesurrounding physical materials 112. A fluid-tight connector assembly 114extends through any sealing cap 104 to provide an entry port for power,control and electrical signal cabling 126 to and from one or moreelectronic devices 116. The cooling fluid 120 partially or completelyfills the interior volume of the containment vessel 100 and surroundsthe electronic devices 116. The cooling fluid 120 circulates and/orperforms in a manner as to effect the heat removal from the electronicdevices 116. In this embodiment the cooling fluid 120 circulates to aheat exchanger assembly 356 installed external to, and either adjacentto or remote from, the containment vessel 100.

Heat from the warmer electronic devices 116 is transferred to thecooling fluid 120. The cooling fluid 120 is warmed and moves toward theupper region of the containment vessel 100 where the warmer coolingfluid 372 is circulated out of the containment vessel 100 via outlet 330and connecting line 324 that extends through fluid-tight connectorassembly 314 and connects to one or more external adjacent or remoteheat exchanger assemblies 356. Outlet 330 may be disposed at anylocation inside the containment vessel 100 and may comprise one or moreoutlets 330. The heat exchanger assembly 356 removes a portion of theheat from the warmer cooling fluid 372 and returns the resulting coolercooling fluid 376 to the containment vessel 100 via connecting line 326that extends through fluid-tight connector assembly 316 and furtherextends to any location in the containment vessel 100 returning thecooler cooling fluid 376 to the containment vessel 100 through inlet328. Fluid-tight connector assemblies 314, 316 are comprised of one ormore fluid-tight connections through any sealing cap 104. The coolingfluid 120 begins to move upward in the containment vessel 100, flowingover the electronic devices 116 to continue the heat removal cycle. Anoptional fluid control structure 336 may be used to promote uniformfluid flow over electronic devices 116. Fluid flow in and around theelectronic devices 116 may be accomplished by embodiments of electronicdevices 116 such as those described in FIGS. 7, 8, 9, and/or 10.

The heat exchanger assembly 356 is comprised of at least one heatexchanger system that removes heat from the cooling fluid 120, 372 andrejects the removed heat into the adjacent environment of the heatexchanger assembly 356 or an environment remote to the heat exchangerassembly 356. The heat exchanger assembly 356 is comprised of at leastone heat exchange system that may accomplish heat rejection by a varietyof heat rejection means that include, but are not limited to,ventilation, compression, evaporation, dry cooler, fluid to fluid, andgeothermal. The heat exchanger assembly 356 may use one or more fluidpumps 322 to assist in the circulation action of the cooling fluid 120,372, 376. The heat exchanger assembly 356 is located external to, andeither adjacent to or remote from, the containment vessel 100. A heatexchanger assembly 356 may function to remove heat from the coolingfluid 120 for more than one containment vessel 100. Multiple containmentvessels 100 may be installed together to form a group of containmentvessels 100 that collectively house a large-scale installation ofelectronic devices 116. The containment vessel 100 is optionallycomprised of thermally conductive materials. In one embodimentconfigured for indirect heat transfer from electronic devices 116 tocooling fluid 120, the cooling fluid 120 is segregated into two distinctportions that are structured and function as described in FIG. 11.

FIG. 4 shows a conceptual cross-section of a containment vessel withexternal heat exchanger that encloses electronic devices with coolingwhich is designed for subsurface installation. The containment vessel100 encloses one or more electronic devices 116. The containment vessel100 is a sealed or unsealed structure which is near or any distancebelow surface level 108. The containment vessel 100 is installed ineither a removable or non-removable fashion in surrounding physicalmaterials 112 such as earth, water, or concrete. The sealed embodimentwill have a sealing cap 104 which may be covered by surrounding physicalmaterials 112. The unsealed embodiment will have containment vesselwalls 110 that extend to the surface of the surrounding physicalmaterials 112. A fluid-tight connector assembly 114 extends through anysealing cap 104 to provide an entry port for power, control andelectrical signal cabling 126 to and from one or more electronic devices116. The cooling fluid 120 partially or completely fills the interiorvolume of the containment vessel 100 and surrounds the electronicdevices 116. The cooling fluid 120 circulates and/or performs in amanner as to effect the heat removal from the electronic devices 116. Inthis embodiment the cooling fluid 120 circulates to a heat exchangerassembly 356 installed external to, and either adjacent to or remotefrom, the containment vessel 100.

Heat from the warmer electronic devices 116 is transferred to thecooling fluid 120. The cooling fluid 120 flows in and around theelectronic devices 116 in a manner that includes fluid flows describedin embodiments of electronic devices 116 such as shown in FIGS. 7, 8, 9,and/or 10. The cooling fluid 120 is warmed and moves toward the upperregion of the containment vessel 100 where the warmer cooling fluid 372is circulated out of the containment vessel 100 via outlet 330 andconnecting line 324 that extends through fluid-tight connector assembly314 and connects to one or more external adjacent or remote heatexchanger assemblies 356. Outlet 330 may be disposed at any locationinside the containment vessel 100 and may comprise one or more outlets330. The heat exchanger assembly 356 removes a portion of the heat fromthe warmer cooling fluid 372 and returns the resulting cooler coolingfluid 376 to the containment vessel 100 via connecting line 326 thatextends through fluid-tight connector assembly 316 and further extendsto any location in the containment vessel 100 returning the coolercooling fluid 376 to within the containment vessel 100 through fluiddistribution piping 428 which delivers cooling fluid 120, 376 to eachelectronic device 116 as appropriate. Fluid-tight connector assemblies314, 316 are comprised of one or more fluid-tight connections throughany sealing cap 104. The cooling fluid 120 flows through electronicdevices 116 and the fluid is discharged back into the containment vessel100 through fluid exit ports 221. Fluid exit ports 221 are shown asrepresentative of ports that allow cooling fluid 120 to be dischargedfrom the interior of any electronic device 116. Each electronic device116 may include any number of fluid exit ports 221 that may be locatedat any appropriate location on a electronic device 116. The coolingfluid 120 moves both convectively and under circulation action towardthe upper region of the containment vessel 100. The fluid distributionpiping 428 may be optionally configured to allow a portion of thecirculating cooling fluid 120 to be released into the containment vessel100 via ports 429 enabling cooling fluid 120 to flow upward in thecontainment vessel 100 over the electronic devices 116 toward the upperregion of the containment vessel 100 thereby effecting additional heattransfer from the electronic devices 116. An optional fluid controlstructure 336 may be used to promote uniform fluid flow over electronicdevices 116.

The heat exchanger assembly 356 is comprised of at least one heatexchanger system that removes heat from the cooling fluid 120, 372 andrejects the removed heat into the adjacent environment of the heatexchanger assembly 356 or an environment remote to the heat exchangerassembly 356. The heat exchanger assembly 356 is comprised of at leastone heat exchange system that may accomplish heat rejection by a varietyof heat rejection means that include, but are not limited to,ventilation, compression, evaporation, dry cooler, fluid to fluid, andgeothermal. The heat exchanger assembly 356 may use one or more fluidpumps 322 to assist in the circulation action of the cooling fluid 120,372, 376. The heat exchanger assembly 356 is located external to, andeither adjacent to or remote from, the containment vessel 100. A heatexchanger assembly 356 may function to remove heat from the coolingfluid 120 for more than one containment vessel 100. Multiple containmentvessels 100 may be installed together to form a group of containmentvessels 100 that collectively house a large-scale installation ofelectronic devices 116. The containment vessel 100 is optionallycomprised of thermally conductive materials. In one embodimentconfigured for indirect heat transfer from electronic devices 116 tocooling fluid 120, the cooling fluid 120 is segregated into two distinctportions that are structured and function as described in FIG. 11.

FIG. 5 shows a conceptual cross-section of a containment vessel withexternal subsurface heat exchanger that encloses electronic devices withcooling which is designed for subsurface installation. FIG. 5 shows aconfiguration similar to that of FIG. 4, the primary difference beingthat heat exchanger assembly 356 and optional fluid pump 322 are locatedin a subsurface environment external to, and either adjacent to orremote from, the containment vessel 100.

FIG. 6 shows a conceptual cross-section of a containment vessel withexternal heat exchanger that encloses electronic devices with coolingwhich is designed for human-accessible subsurface installation. FIG. 6shows a configuration similar to that of FIG. 4, the primary differencebeing the presence of a secondary containment vessel 610 that issufficiently large and of the correct environment and structure tofacilitate human access, inspection, and maintenance of at least aportion of the containment vessel 100. Multiple containment vessels 100may be installed in a single secondary containment vessel 610. Thecontainment vessel 100 is installed in either a removable ornon-removable fashion inside the secondary containment vessel 610. Thesecondary containment vessel 610 is installed in surrounding physicalmaterials 112 such as earth, water, or concrete and contains a humanaccessible extension 612 to the surface. The containment vessel 100 willallow human access inside the containment vessel 100, optionally throughan access panel or port 606.

FIG. 7 shows a conceptual cross-section of an electronic device designedfor subsurface installation that comprises electronic components thatare cooled by external cooling fluid circulation. FIGS. 1, 2, 3, 4, 5,and/or 6 above refer to the electronic device of this section as anelectronic device 116. This embodiment provides an enclosure 700 for theelectronic device, with a fluid filled interior space 704, and an entryport for power, control and electrical signal cabling 726. The exteriorsurface of the enclosure 700 is in contact with a surrounding coolingfluid 712 which circulates and is cooled in any of the manners describedfor FIGS. 1, 2, 3, 4, 5, and/or 6 above. Cooling fluid 712 mayoptionally be circulated within enclosure 700 by various devicesincluding fluid circulators, fluid fans, and fluid pumps that arelocated internally or externally to enclosure 700.

The electronic components which are interior to the enclosure 700include one or more power supplies 716, one or more data storageassemblies 720 comprising disk drives or other type of storage units,one or more motherboard assemblies 724, and other custom electronicdevice assembly 728 that may be required by a particular application.The motherboard assembly 724, power supply assembly 716, data storageassembly 720, and custom electronic device assembly 728 are electroniccomponent assemblies that contain electronic components that have beenarranged in a manner to facilitate proper operation and optimal heattransfer; they may be bracket mounted and open to the interior of theenclosure 700 or each electronic component assembly 724, 716, 720, 728may be fully enclosed as a unit in order to either contain a secondarycooling fluid such as a dielectric or to isolate the electroniccomponent assembly 724, 716, 720, 728 from direct contract with eitherthe cooling fluid 712 or another secondary cooling fluid. Eachelectronic component assembly 724, 716, 720, 728 will have cableentrances for power and electrical signaling that serve to interconnectthe electronic component assemblies. Each electronic component assembly724, 716, 720, 728 may be mounted in such a fashion as to transfer heatdirectly from the electronic component assembly 724, 716, 720, 728 tothe wall of the enclosure 700. The interior 704 of the enclosure 700 maycontain fluids separated by interior partitions and control structuresthat serve to transfer heat from the inward facing surfaces ofelectronic component assemblies 724, 716, 720, 728 to the outer wall ofthe enclosure 700. The electronic component assemblies interior to theenclosure 700 do not need to be arranged exactly as shown and may havevarious arrangements to facilitate heat transfer and operation. Multipleenclosures 700 may be connected in a single logical and/or physicalstructure as to form a single operating and/or installed unit.

FIG. 8 shows a conceptual cross-section of an electronic device designedfor subsurface installation that comprises electronic components thatare cooled by interior channel and external cooling fluid circulation.FIGS. 1, 2, 3, 4, 5, and/or 6 above refer to the electronic device ofthis section as an electronic device 116. This embodiment provides anenclosure 850 for the electronic device, with a fluid filled interiorspace 854, and an entry port for power, control and electrical signalcabling 826. This embodiment has a pipe-like cylindrical or tubularenclosure 850 of various cross-sectional geometries and lengths thatallow the flow 862 of cooling fluid 860 through one or more channels inits central space. The exterior surface of the enclosure 850 is incontact with a surrounding cooling fluid 860. The enclosure 850 has asealing cap 866 with an entry port through which the cooling fluid 860is forced 862. The cooling fluid 860 is warmed by contact with thesurfaces of the enclosure 850 as it flows downward 862; the coolingfluid 860 exits at the bottom of the enclosure 850, then flows acrossthe enclosure 850 surfaces as it rises 864; the cooling fluid 860 iscirculated and cooled in any of the manners described for FIGS. 1, 2, 3,4, 5, and/or 6 above. Cooling fluid 860 may optionally be circulatedwithin or through enclosure 850 by various devices including fluidcirculators, fluid fans, and fluid pumps that are located internally orexternally to enclosure 850.

The electronic components interior to the enclosure 850 include one ormore power supplies 870, one or more data storage assemblies 874comprising disk drives or other type of storage units, one or moremotherboard assemblies 878, and other custom electronic device assembly882 that may be required by a particular application. The motherboardassembly 878, power supply assembly 870, data storage assembly 874, andcustom electronic device assembly 882 are electronic componentassemblies that contain electronic components that have been arranged ina manner to facilitate proper operation and optimal heat transfer; theymay be bracket mounted and open to the interior of the enclosure 850 oreach electronic component assembly 878, 870, 874, 882 may be fullyenclosed as a unit in order to either contain a secondary cooling fluidsuch as a dielectric or to isolate the electronic component assembly878, 870, 874, 882 from direct contract with either the cooling fluid860 or another secondary cooling fluid. Each electronic componentassembly 878, 870, 874, 882 will have cable entrances for power andelectrical signaling that serve to interconnect the electronic componentassemblies. Each electronic component assembly 878, 870, 874, 882 may bemounted in such a fashion as to transfer heat directly from theelectronic component assembly 878, 870, 874, 882 to the wall of theenclosure 850. The interior 854 of the enclosure 850 may contain fluidsseparated by interior partitions and control structures that serve totransfer heat from the inward facing surfaces of electronic componentassemblies 878, 870, 874, 882 to the outer wall of the enclosure 850.The electronic component assemblies interior to the enclosure 850 do notneed to be arranged exactly as shown and may have various arrangementsto facilitate heat transfer and operation. The circulation of thecooling fluid 860 may be reversed by moving the sealing cap 866, throughwhich the cooling fluid 860 is forced 862, to the bottom of theenclosure 850. Multiple enclosures 850 may be connected in a singlelogical and/or physical structure as to form a single operating and/orinstalled unit.

FIG. 9 shows a conceptual cross-section of an electronic device designedfor subsurface installation that comprises electronic components thatare cooled by internal cooling fluid circulation. FIGS. 1, 2, 3, 4, 5,and/or 6 above refer to the electronic device of this section as anelectronic device 116. This embodiment provides an enclosure 900 for theelectronic device, with a fluid filled interior space 904, and an entryport for power, control and electrical signal cabling 926. Thisembodiment has a pipe-like cylindrical or tubular enclosure of variouscross-sectional geometries and lengths that allow the flow 918 ofcooling fluid 910 through the interior 904 of the enclosure 900 andaround the interior electronic component assemblies. The exteriorsurface of the enclosure 900 is in contact with a surrounding coolingfluid 910. The enclosure 900 has a sealing cap 916 with an entry portthrough which the cooling fluid 910 is forced 912. The cooling fluid 910is warmed by contact with the interior electronic component assembliesand exits the enclosure 914 through the exit ports 940 into thecontainment vessel. The cooling fluid 910 is circulated and cooled inany of the manners described for FIGS. 1, 2, 3, 4, 5, and/or 6 above.Cooling fluid 910 may optionally be circulated within or throughenclosure 900 by various devices including fluid circulators, fluidfans, and fluid pumps that are located internally or externally toenclosure 900.

The electronic components interior to the enclosure 900 include one ormore power supplies 920, one or more data storage assemblies 924comprising disk drives or other type of storage units, one or moremotherboard assemblies 928, and other custom electronic device assembly932 that may be required by a particular application. The motherboardassembly 928, power supply assembly 920, data storage assembly 924, andcustom electronic device assembly 932 are electronic componentassemblies that contain electronic components that have been arranged ina manner to facilitate proper operation and optimal heat transfer; eachelectronic component assembly 928, 920, 924, 932 is fully enclosed as aunit in order to either contain a secondary cooling fluid such as adielectric or to isolate the electronic component assembly 928, 920,924, 932 from direct contract with either the cooling fluid 910 oranother secondary cooling fluid. Each electronic component assembly 928,920, 924, 932 will have cable entrances for power and electricalsignaling that serve to interconnect the electronic componentassemblies. Each assembly electronic component 928, 920, 924, 932 may bemounted in such a fashion as to transfer heat directly from theelectronic component assembly 928, 920, 924, 932 to the wall of theenclosure 900. Alternatively or additionally, each electronic componentassembly 928, 920, 924, 932 could be mounted in a fashion to maximizethe electronic component assembly 928, 920, 924, 932 contact withcooling fluid 910 within enclosure 900. The electronic componentassemblies interior to the enclosure 900 do not need to be arrangedexactly as shown and may have various arrangements to facilitate heattransfer and operation. The circulation of the cooling fluid 910 may bereversed by moving the sealing cap 916 through which the cooling fluid910 is forced to the bottom of the enclosure 900. Multiple enclosures900 may be connected in a single logical and/or physical structure as toform a single operating and/or installed unit.

FIG. 10 shows a conceptual cross-section of an electronic devicedesigned for subsurface installation that comprises electroniccomponents that are cooled by interior channel and internal coolingfluid circulation. FIGS. 1, 2, 3, 4, 5, and/or 6 above refer to theelectronic device of this section as an electronic device 116. Thisembodiment provides an enclosure 1050 for the electronic device, with afluid filled interior space 1054, and an entry port for power, controland electrical signal cabling 1026. This embodiment has a pipe-likecylindrical or tubular enclosure of various cross-sectional geometriesand lengths that allow the flow 1062 of cooling fluid 1060 through oneor more channels in its central space, into the interior 1054 of theenclosure 1050, and flows 1068 around the interior electronic componentassemblies. The exterior surface of the enclosure 1050 is in contactwith a surrounding cooling fluid 1060. The enclosure 1050 has one ormore upper and lower sealing caps 1066 through which the cooling fluid1060 is forced 1062. The cooling fluid 1060 enters the interior space1054 through one or more entry ports 1070; once inside the interiorspace 1054, the cooling fluid 1060 flows 1068 around the interiorelectronic component assemblies and is warmed by contact with theinterior electronic component assemblies; the cooling fluid 1060 exitsthe enclosure 1064 through the exit ports 1090 into the containmentvessel. The cooling fluid 1060 is circulated and cooled any of themanners described for FIGS. 1, 2, 3, 4, 5, and/or 6 above. Cooling fluid1060 may optionally be circulated within or through enclosure 1050 byvarious devices including fluid circulators, fluid fans, and fluid pumpsthat are located internally or externally to enclosure 1050.

The electronic components interior to the enclosure 1050 include one ormore power supplies 1074, one or more data storage assemblies 1078comprising disk drives or other type of storage units, one or moremotherboard assemblies 1082, and other custom electronic device assembly1086 that may be required by a particular application. The motherboardassembly 1082, power supply assembly 1074, data storage assembly 1078,and custom electronic device assembly 1086 are electronic componentassemblies that contain electronic components that have been arranged ina manner to facilitate proper operation and optimal heat transfer; eachelectronic component assembly 1082, 1074, 1078, 1086 is fully enclosedas a unit in order to either contain a secondary cooling fluid such as adielectric or to isolate the electronic component assembly 1082, 1074,1078, 1086 from direct contract with either the cooling fluid 1060 oranother secondary cooling fluid. Each electronic component assembly1082, 1074, 1078, 1086 will have cable entrances for power andelectrical signaling that serve to interconnect the electronic componentassemblies. Alternatively or additionally, each electronic componentassembly 1082, 1074, 1078, 1086 could be mounted in a fashion tomaximize the electronic component assembly 1082, 1074, 1078, 1086contact with cooling fluid 1060 within enclosure 1050. Each electroniccomponent assembly 1082, 1074, 1078, 1086 may be mounted in such afashion as to transfer heat directly from the electronic componentassembly 1082, 1074, 1078, 1086 to the wall of the enclosure 1050. Theelectronic component assemblies interior to the enclosure 1050 do notneed to be arranged exactly as shown and may have various arrangementsto facilitate heat transfer and operation. The circulation of thecooling fluid 1060 may be reversed by removing the warmed fluid from oneor more channels in central space of the enclosure 1050 and introducingthe cooled fluid into the enclosure 1050 via the exit ports 1090.Multiple enclosures 1050 may be connected in a single logical and/orphysical structure as to form a single operating and/or installed unit.

FIG. 11 shows an embodiment of indirect heat transfer using an internalheat exchanger. FIG. 11 shows a configuration for heat transfer that maybe optionally used in FIGS. 3, 4 to effect indirect heat transfer fromelectronic devices 116 to a heat exchanger assembly installed externalto, and either adjacent to or remote from, the containment vessel 100.FIG. 11 shows a portion of the diagrams in FIGS. 3, 4 in order toillustrate the indirect cooling configuration. FIG. 11 shows anembodiment in which the cooling fluid 120 as designated in FIGS. 3, 4 issegregated into two distinct portions designated 120 a and 120 b.Cooling fluid 120 a circulates to one or more heat exchanger assemblies1101 then to a heat exchanger assembly 356 as designated in FIGS. 3, 4installed external to, and either adjacent to or remote from, thecontainment vessel 100. Cooling fluid 120 b partially or completelyfills the interior volume of the containment vessel 100 and surroundsthe electronic devices 116. Cooling fluid 120 b circulates and/orperforms in a manner as to effect the heat removal from the electronicdevices 116. Cooling fluid 120 b circulation may optionally assisted byone or more fluid circulators 132 as designated in FIG. 1, fluid pumps210 as designated in FIG. 2, and/or fluid distributed piping and outlets220, 326, 328, 428, 429 as designated in FIGS. 2, 3, 4. Heat from thewarmer electronic devices 116 is transferred to the cooling fluid 120 b.The cooling fluid 120 b is warmed and is circulated and/or moves towardthe upper region of the containment vessel 100. Heat exchanger assembly1101 transfers heat from cooling fluid 120 b to cooling fluid 120 a. Thewarmer cooling fluid 120 a, 372 passes through connecting line 324 thatextends through fluid-tight connector assembly 314 and connects to oneor more external adjacent or remote heat exchanger assemblies 356 anduses optional fluid pumps 322 as designated in FIGS. 3, 4. The heatexchanger assembly 356 as designated in FIGS. 3, 4 removes a portion ofthe heat from the warmer cooling fluid 120 a, 372 and returns theresulting cooler cooling fluid 120 a, 376 to the containment vessel 100via connecting line 326 that extends through fluid-tight connectorassembly 316 and connects to heat exchanger assembly 1101.

Although example diagrams to implement the elements of the disclosedsubject matter have been provided, one skilled in the art, using thisdisclosure, could develop additional embodiments to practice thedisclosed subject matter and each is intended to be included herein.Although many of the embodiments refer to a computer system or systems,this is merely exemplary and is not intended to limit the scope of thisdisclosure as the disclosed subject matter could be employed by someoneskilled in the art, with the assistance of this disclosure, to cool anyitem which produces heat. Further, although discussed throughout asbeing positioned predominantly subsurface, one skilled in the art, withthe assistance of this disclosure, could implement the teachings in anon-subsurface position. Finally, the embodiments disclosed couldfunction without the need for traditional forced or passive air cooling.

In addition to the above described embodiments, those skilled in the artwill appreciate that this disclosure has application in a variety ofarts and situations and this disclosure is intended to include the same.

What is claimed is:
 1. A system to cool electronic devices installed ina subsurface environment, the system comprising: a containment vesselcomprising: a first thermally conductive fluid; a second thermallyconductive fluid at least partially filling an interior space of saidcontainment vessel; one or more electronic devices disposed within theinterior space of said containment vessel, a number of the one or moreelectronic devices being in direct, indirect, or direct and indirectthermal contact with said second thermally conductive fluid to performheat exchange between the number of the one or more electronic devicesand to yield a heated said second thermally conductive fluid; a pipingassembly configured to flow heated said first thermally conductive fluidfrom a second heat exchanger located internal to said containment vesselto a first heat exchanger located external to said containment vessel;said piping assembly configured to flow cooled said first thermallyconductive fluid from said first heat exchanger to said second heatexchanger; and cabling which is extended from the interior space of saidcontainment vessel to a location external to said containment vessel;and a heat exchanger circuit comprising: said first heat exchangerlocated external to said containment vessel, wherein said first heatexchanger is configured to receive heated said first thermallyconductive fluid from said second heat exchanger and wherein said firstheat exchanger is configured to perform a cooling operation on saidfirst thermally conductive fluid; said second heat exchanger locatedinternal to said containment vessel, wherein said second heat exchangeris configured to receive cooled said first thermally conductive fluidfrom said first heat exchanger and wherein said second heat exchanger isconfigured to perform a cooling operation on said second thermallyconductive fluid; said piping assembly configured to flow heated saidfirst thermally conductive fluid and wherein said piping assembly isconfigured to guide the flow of heated said first thermally conductivefluid from said second heat exchanger to said first heat exchanger; andsaid piping assembly configured to flow cooled said first thermallyconductive fluid and wherein said piping assembly is configured to guidethe flow of cooled said first thermally conductive fluid from said firstheat exchanger to said second heat exchanger.
 2. The system of claim 1,wherein the subsurface environment includes at least one of: a body ofwater; a borehole; an excavation; an underground structure; or anycombination thereof.
 3. The system of claim 2, wherein the body of waterhas a surface exposed to open air.
 4. The system of claim 1, wherein theone or more electronic devices are grouped into one or more individualsubsystems, wherein each of the subsystems are enclosed in individualcases or housings.
 5. The system of claim 1, wherein said containmentvessel is comprised of a thermally conductive material.
 6. The system ofclaim 1, further comprising one or more circulating devices configuredto circulate said second thermally conductive fluid within saidcontainment vessel, wherein the one or more circulating devices includeat least one of: a fluid circulator; a fluid pump; fluid distributionpiping and outlets; or any combination thereof.
 7. The system of claim1, additionally comprising one or more cables, the one or more cablespassing through an opening in said containment vessel, wherein the oneor more cables includes at least one of: a power cable; a control cable;a data cable; a communications cable; or a signal cable.
 8. The systemof claim 1, additionally comprising a removable panel to access theinterior space of said containment vessel.
 9. The system of claim 1,wherein said containment vessel is disposed within a subsurface openinglarger than said containment vessel.
 10. The system of claim 1, whereinsaid containment vessel is removable from the sub-surface environment.11. The system of claim 1, wherein at least one of the one or moreelectronic devices is: a power supply; a motherboard; a memory module; acentral processing unit; a magnetic, optical, or electronic data storageunit; or a data transfer device.
 12. The system of claim 1, additionallycomprising a cap forming a sealing enclosure of said containment vessel.13. The system of claim 1, wherein said first heat exchanger is locatedremote from said containment vessel.
 14. The system of claim 1, whereinsaid containment vessel is disposed completely in the subsurfaceenvironment.
 15. The system of claim 1, wherein said containment vesselis not a human-inhabited space.
 16. The system of claim 1, wherein saidpiping assembly is further configured to flow heated said firstthermally conductive fluid from a second heat exchanger located internalto said containment vessel through an opening in said containment vesselto a first heat exchanger located external to said containment vessel.17. The system of claim 16, wherein said piping assembly is furtherconfigured to flow cooled said first thermally conductive fluid fromsaid first heat exchanger through said opening in said containmentvessel to said second heat exchanger.
 18. The system of claim 1, whereinsaid piping assembly is further configured to flow heated said firstthermally conductive fluid from a second heat exchanger located internalto said containment vessel through a first opening in said containmentvessel to a first heat exchanger located external to said containmentvessel and said piping assembly is further configured to flow cooledsaid first thermally conductive fluid from said first heat exchangerthrough a second opening in said containment vessel to said second heatexchanger.
 19. A method to cool electronic devices installed in asubsurface environment, the method comprising: containing electronicdevices in a subsurface environment comprising a containment vessel:providing a first thermally conductive fluid; at least partially fillingan interior space of said containment vessel with a second thermallyconductive fluid; disposing one or more electronic devices within theinterior space of said containment vessel, and thermally contacting anumber of the one or more electronic devices directly, indirectly, ordirectly and indirectly with said second thermally conductive fluid toperform heat exchange between the number of the one or more electronicdevices and to yield a heated said second thermally conductive fluid;configuring a piping assembly to flow heated said first thermallyconductive fluid from a second heat exchanger located internal to saidcontainment vessel to a first heat exchanger located external to saidcontainment vessel; configuring said piping assembly to flow cooled saidfirst thermally conductive fluid from said first heat exchanger to saidsecond heat exchanger; and extending cabling from the interior space ofsaid containment vessel to a location external to said containmentvessel; and converting heated said first thermally conductive fluid intocooled said first thermally conductive fluid and converting heated saidsecond thermally conductive fluid into cooled said second thermallyconductive fluid using a heat exchanger circuit comprising the steps of:locating said first heat exchanger external to said containment vessel,wherein said first heat exchanger is configured to receive heated saidfirst thermally conductive fluid from said second heat exchanger andwherein said first heat exchanger is configured to perform a coolingoperation on said first thermally conductive fluid; locating said secondheat exchanger internal to said containment vessel, wherein said secondheat exchanger is configured to receive cooled said first thermallyconductive fluid from said first heat exchanger and wherein said secondheat exchanger is configured to perform a cooling operation on saidsecond thermally conductive fluid; configuring said piping assembly toflow heated said first thermally conductive fluid and wherein said pipeassembly is configured to guide the flow of heated said first thermallyconductive fluid from said second heat exchanger to said first heatexchanger; and configuring said piping assembly to flow cooled saidfirst thermally conductive fluid and wherein said pipe assembly isconfigured to guide the flow of cooled said first thermally conductivefluid from said first heat exchanger to said second heat exchanger. 20.The method of claim 19, wherein the subsurface environment includes atleast one of: a body of water; a borehole; an excavation; an undergroundstructure; or any combination thereof.
 21. The method of claim 20,wherein the body of water has a surface exposed to open air.
 22. Themethod of claim 19, wherein the one or more electronic devices aregrouped into one or more individual subsystems, wherein each of thesubsystems are enclosed in individual cases or housings.
 23. The methodof claim 19, wherein said containment vessel is comprised of a thermallyconductive material.
 24. The method of claim 19, further comprising oneor more circulating devices configured to circulate said secondthermally conductive fluid within said containment vessel, wherein theone or more circulating devices include at least one of: a fluidcirculator; a fluid pump; fluid distribution piping and outlets; or anycombination thereof.
 25. The method of claim 19, additionally comprisingone or more cables, the one or more cables passing through an opening insaid containment vessel, wherein the one or more cables includes atleast one of: a power cable; a control cable; a data cable; acommunications cable; or a signal cable.
 26. The method of claim 19,additionally comprising a removable panel to access the interior spaceof said containment vessel.
 27. The method of claim 19, wherein saidcontainment vessel is disposed within a subsurface opening larger thansaid containment vessel.
 28. The method of claim 19, wherein saidcontainment vessel is removable from the sub-surface environment. 29.The method of claim 19, wherein at least one of the one or moreelectronic devices is: a power supply; a motherboard; a memory module; acentral processing unit; a magnetic, optical, or electronic data storageunit; or a data transfer device.
 30. The method of claim 19,additionally forming a sealing enclosure using a cap on said containmentvessel.
 31. The method of claim 19, wherein said first heat exchanger islocated remote from said containment vessel.
 32. The method of claim 19,wherein said containment vessel is disposed completely in the subsurfaceenvironment.
 33. The method of claim 19, wherein said containment vesselis not a human-inhabited space.
 34. The method of claim 19, furtherconfiguring said piping assembly to flow heated said first thermallyconductive fluid from a second heat exchanger located internal to saidcontainment vessel through an opening in said containment vessel to afirst heat exchanger located external to said containment vessel. 35.The method of claim 34, furthering configuring said piping assembly toflow cooled said first thermally conductive fluid from said first heatexchanger through said opening in said containment vessel to said secondheat exchanger.
 36. The method of claim 19, further configuring saidpiping assembly to flow heated said first thermally conductive fluidfrom a second heat exchanger located internal to said containment vesselthrough a first opening in said containment vessel to a first heatexchanger located external to said containment vessel and furtheringconfiguring said piping assembly to flow cooled said first thermallyconductive fluid from said first heat exchanger through a second openingin said containment vessel to said second heat exchanger.